Citing Economic News Daily, TSMC CEO C.C. Wei commented on the complexity of mass production of 3nm wafers. The biggest obstacle, he claims, is the shortage of 3nm R&D personnel, which TSMC aims to address. Wei also said that many customers are excited about TSMC’s N3 technology, which could includeapple。
Currently, TSMC is reported to employ around 2,000 people in its 3nm R&D department, with more to come in the future. Previously, TSMC’s 5nm process was said to be used to mass-produce Apple’s M2 Pro and M2 Max, meaning the company’s 3nm node is either facing issues or giving up entirely in favor of the improved N3E. On the surface, TSMC is ready to ensure completion includingiPhoneOrders from various customers including manufacturers.
Wei Zhejia said yesterday (30th) that the development of TSMC’s 3nm process “has indescribable difficulties”, but it will still be mass-produced as expected. Due to the active cooperation of many customers, it has also made engineering personnel tight and is trying their best. He also promised that TSMC’s 3nm process will be mass-produced in 2025, which will be the most advanced and best technology.