The ROG 6 Dimensity 9000+ version, the first mobile phone that supports open-cover cooling, will surpass the Snapdragon 8+
Today, the news blogger Digital Chat Station brought the latest news that the machine will be equipped with a new cooling scheme, and the overall effect is very strong.There is a high probability that AnTuTu’s benchmark scores will exceed Qualcomm’s.
According to the latest August performance list released by AnTuTu, the Red Devils 7S is currently the strongest in the Qualcomm camp, with a running score of 1.12 million, and the new ROG 6 Dimensity Extreme Edition may exceed this number.
On the one hand, the ROG 6 Dimensity Extreme Edition can achieve this result because the stacking material is relatively fierce. In addition to the Dimensity 9000+, there are also top-level storage specifications, and the adjustment is more aggressive.
Of course, the quality of heat dissipation greatly affects the performance of extreme performance, and the ROG 6 Dimensity Extreme Edition has achieved unprecedented this time.
It was revealed in an official video a few days ago,The ROG 6 Dimensity Extreme Edition has a part on the back shell that can be physically “opened”, which can directly open the internal heat dissipation fins to achieve faster and direct heat exchange.
In addition, the machine will also be equipped with an array liquid cooling structure, which is made of aerospace-grade cooling material boron nitride, which can efficiently dissipate CPU heat and quickly dissipate heat with the help of a greatly increased area of the vapor chamber and graphene.
In other respects, the ROG 6 Dimensity Extreme Edition will be equipped with a 6.78-inch ultra-high brush rigid straight screen, built-in 6000mAh dual-cell + 65W fast charge, and the image will bring the IMX766 outsole main camera, which is very worth looking forward to.