Moonsoo Kang, senior vice president and head of the foundry market strategy team of Samsung Electronics, said: “The H-Cube solution was jointly developed with Samsung Electro-Mechanics (SEMCO) and Amkor Technology, and is suitable for high-performance semiconductors that require the integration of a large number of silicon chips. To expand and enrich the foundry ecosystem, we will provide various packaging solutions and find breakthroughs in the challenges faced by customers.”
JinYoung Kim, Senior Vice President of Amkor Technology’s Global R&D Center, said: “In today’s system integration and substrate supply-constrained environment, Samsung Foundry and Amkor Technology successfully co-developed H-Cube to overcome these challenges. This development reduces The entry barriers of the HPC/AI market are shown, and the successful cooperation and partnership between foundries and outsourced semiconductor assembly and test (OSAT) companies”.
H-Cube structure and characteristics
2.5D packaging technology integrates logic chips and high-bandwidth memory chips between square inches through a silicon interposer. Samsung’s H-CubeTM packaging solution integrates two substrates with different characteristics: refined ABF (Ajinomoto Build-up Film) substrates and HDI (High Density Interconnection) substrates , Can further achieve a larger 2.5D package.
Especially in the case of integrating 6 or more HBMs, the difficulty of manufacturing large-area ABF substrates increases sharply, resulting in a decrease in production efficiency. We have solved this problem well by adopting the structure of superimposing a large area HDI substrate on the high-end ABF substrate. By shortening the pitch of the solder balls connecting the chip and the substrate by 35%, the size of the ABF substrate can be reduced. At the same time, an HDI substrate is added under the ABF substrate to ensure the connection with the system board.
By reducing the solder ball pitch of the electrical connection chip and the substrate by 35% compared to the traditional solder ball pitch, the size of the fine pitch substrate can be minimized, and an HDI substrate (module PCB) is added under the fine pitch substrate to ensure the connection with the system board . In addition, in order to improve the reliability of the H-Cube solution, Samsung applied its proprietary signal/power integrity analysis technology, which can stably provide power while stacking multiple logic chips and HBM while minimizing the signal Loss or distortion.