To this end, the Russian government has launched a national plan to develop a 28-nanometer process by 2030, hoping to reverse engineer foreign chips and cultivate local semiconductor talents.
However, due to international sanctions, American and European semiconductor equipment manufacturers cannot supply Russia. If Russia promotes the 28-nanometer process, it must design and develop domestic equipment. It’s just that companies like ASML and Applied Materials take decades to develop, and update iterations must be completed in about 8 years.
However, Russia does not seem to be worried at all. The Russian Novgorod Strategy Development Agency (Novgorod Strategy Development) made a bold statement, claiming that the Institute of Applied Physics of the Russian Academy of Sciences will fall below everyone’s glasses and develop a product that can be produced in 2028. The lithography machine for 7-nanometer chips can also beat similar products from ASML.
The deputy director of the Institute of Nanostructures of the Russian Academy of Sciences said that ASML, a global lithography machine leader, has been working on EUV exposure machines for nearly 20 years, with the goal of maintaining high production efficiency for the world’s top semiconductor manufacturers. But Russia doesn’t need it, just move forward according to Russian domestic needs.
The report bluntly stated that Russia’s idea seems too naive. It is not feasible for Russia to develop a lithography machine that can support 7-nanometer chips within 6 years. Moreover, the fab can produce chips not only by the lithography machine, but also need Many devices, which Russia does not produce. (Proofreading/Wang Wanqing)