Two of the three dies (on one side) are Zen 4 CCDs fabricated at the 5nm process node. The larger one in the middle is the IOD using the 6nm process.
For comparison, the AMD Ryzen 7000 series CCD has a die size of 70 mm2 (83 mm2 for Zen 3) and has 6.57 billion transistors – a 58% increase over the Zen 3 CCD’s 4.15 billion.
Hands-On with Delidded AMD Ryzen 9 7950X CPU – Gamers Nexus
In addition, althoughIntelLGA-packaged CPUs have several SMD capacitors/resistors (SMDs) placed under the package substrate, but this generation of AMD AM5 desktop CPUs still puts it on top.
AMD technical marketing director Robert Hallock also humorously called this top cover notch design “octopus”. It should be noted, however, that under each “claw” is the brazing material used to connect the interposer.
For DIYers who want to try to “open the lid”, this means that this operation will become more difficult – because each “armspan” position is next to an array of chip capacitors.
Even so, Der8auer, a well-known German overclocking expert, introduced Gamers Nexus to the in-development and upcoming deliding kit for the AM5 CPU.
In addition, Der8auer tried to explain why the Ryzen 7000 series desktop CPU uses a gold-plated CCD solution:
The gold plating means AMD can easily solder to the brazing material (indium) without the use of flux and without the need for aggressive chemicals on the CPU.
While it is theoretically possible to solder a silicon wafer to a copper cap (IHS) even without the gold coating, it is more difficult in practice, not to mention the use of oxide-destroying fluxes.
It is also reported that the smaller IHS surface area means that the Zen 4 Ryzen 7000 series AM5 desktop processors are better compatible with existing round or square water blocks.
Although the square-shaped water block is the first choice, the round-bottomed joint is not too limited. In addition, Noctua also recommends the following thermal grease “embellishment” techniques.
A final note is that since each Zen 4 CCD is very close to the edge of the CPU top cap (not necessarily the case with previous generations of Zen processors).
Not only will it be more difficult to open the lid, but since the IOD is placed in the center area, this means that heatsink manufacturers must also prepare accordingly for this CPU design.
According to the plan, AMD will launch the first Ryzen 7000 series AM5 desktop processors in the fall of 2022.
The chip can reach a maximum frequency of 5.85 GHz and package power as high as 230W, so overclockers/enthusiasts must be prepared with a sufficient cooling budget.