The latest news is that TSMC CEO CC Wei admitted in a recent interview with the South China Morning Post that the company is facing delayed deliveries, driven by global expansion.
But even if it is dragged down by a sluggish supply chain and other factors, TSMC will soon produce ultra-advanced 3nm chips. CC Wei said at an annual tech forum:
At first seeing automakers suffering from chip shortages, people wondered that the industry didn’t fully understand the importance of chips.
But then TSMC’s own equipment suppliers also encountered delivery delays and were told they were also affected by component and chip shortages.
It turns out that over the past few years, many industries around the world have not realized the importance of supply chain management – even TSMC itself has not done the job well.
Aware of the problems in this regard, TSMC is working hard to ensure the steady progress of related plans, including putting its 3D chip stacking technology (SOIC) into mass production in 2022.
Finally, if all goes well,appleandIntelWill become the first chip foundry customer of TSMC’s 3nm advanced process.
On the other hand, the global memory chip giant and the second largest chip foundry giantSamsungIt said its 2nm process node is in the early stages of development and is expected to enter mass production in 2025.