（viaWCCFTech)
In fact,AMDThe concept of Exascale APU goes all the way back to 2023. Then in 2015, the EHP plan was disclosed.
As an Exascale heterogeneous processor, it was based on the then upcoming Zen x86 core + Greenland GPU and was equipped with HBM2 high-bandwidth cache on a 2.5D interposer.
Adored is back with some new AMD leaks（via)
After the original plan was axed, AMD continued to make efforts in the field of server CPU / GPU accelerators and launched EPYC / Instinct product lines respectively.
However, the latest revelations from AdoredTV suggest that the company is relaunching the EHP / Exascale APU in the form of the next-generation Instinct MI300.
By combining the latest Zen 4 CPU + CDNA 3 GPU cores, AMD intends to launch the first generation Exascale & Instinct APU.
If the news is reliable, the APU may be taped out at the end of this month and released in 2023. At the same time, the company is expected to provide an HPC product line based on CDNA 3 GPU.
Early chips will be live on AMD Labs’ MDC platform by 3Q22 (hinting a multi-chip solution).
An earlier report claimed that the chip has a novel “Exascale APU mode” and comes in a BGA package + SH5 socket.
In addition to the CPU/GPU IP, AMD has integrated HBM3 high-bandwidth cache for the Instinct MI300 APU. While the exact number of chiplets on the EHP APU is unclear, Moore’s Law Is Dead has revealed a 2/4/8 HBM3 configuration.
The leaked slides also shared at least 6 sets of molds, implying a brand new configuration — presumably there are multiple Instinct MI300-derived SKUs in the works, some with pure CDNA 3 GPU chips and others with Zen 4 CPU+ APU combination of CDNA3 GPU.
In any case, the AMD Instinct MI300 will become an important force in promoting the transformation of HPC core and packaging technology in the technology industry with amazing performance, and will be compatible with next year’s NVIDIA Grace+Hopper super chip /IntelThe Ponte Vecchio HPC accelerator is in direct competition.
