（viaWCCFTech)
The first is the 2021-2023 roadmap for EPYC server CPU + supporting motherboard platforms, such asAMDThe recently launched EPYC 7003X “Milan-X” brings the SP3 platform to a successful conclusion with Zen 3 core + 3D V-Cache.
Next, AMD will turn its attention to the SP5 platform based on the LGA 6096 socket, complemented by at least two generations of processor lineups – namely Genoa and Bergamo.
The former has up to 96 Zen 4 cores/200-400W SKUs, while the latter has up to 128 Zen 4 cores/320-400W SKUs.
As a high-end platform, the SP5 also has single-socket/dual-socket server options, supporting 12 lanes of DDR5 memory, up to 160 PCIe 5.0 and 64 CXL V1.1+ lanes, and 12 PCIe 3.0.
Like the video Moore’s Law Is Dead shared the day before, Adored TV mentioned Genoa-X in the roadmap it shared. It is expected that this series of Snapdragon CPUs will be produced by the end of 1-3 quarters of 2023 and will be launched around mid-2023.
They use a similar design approach to the 3D V-Cache version of the Milan-X chip, and the large L3 cache will be a highlight of this series of SKUs. In general, the SP5 platform is expected to be finally compatible with the three-series EPYC CPU.
As for SP6, it is said to be just a cost-optimized version of SP6 for edge servers – offering a single-socket solution, 6-channel memory, 96 PCIe 5.0 + 48 CXL V1.1+ lanes, and 8 PCIe 3.0.
The SP6 is expected to use Zen 4 EPYC processors, but only in entry-level SKU options – up to 32-core Zen 4 / 64-core Zen 4C with thermal design power (TDP) between 70-225W.
In addition, SP6 is expected to support entry-level derivatives of the Genoa, Bergamo, and even Turin series, focusing on areas such as edge/telco that focus on computing density and performance-per-watt optimization.
In addition, in the leaked document found by @Olrak, it is known that the SP6 socket looks very similar to the SP3 (58.5×75.4), so we speculate that it is also similar to the package layout of the existing EPYC CPU.
However, this series of chips may not have the completed 12 groups of small chips like Bergamo, but will follow the mature 8 groups of small chips, and the internal pin layout has also been changed from LGA 4096 (SP3) to LGA 4844.
Adored is back with some new AMD leaks（via)
Finally, most of these products are expected to arrive during the second half of 2022 – the first half of 2024. And with the Computex 2022 approaching in late May, AMD is also expected to officially announce a new roadmap soon.
